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JAXov xwm - HUASHIL
SiC - Silicon Carbide Wafer Precision CNC Multifunctional Cylindrical Sib Tsoo Tshuab Pib Kev Xeem
Sijhawm: 2022-12-08 Ntaus: 39
YUHUAN Start Testing a New Model YHMGK1720 Precision CNC Multifunctional Cylindrical Sib Tsoo Tshuab.
This Precision CNC Multifunctional Cylindrical Grinding Machine YHMCK1720 Can Grinding the
SIC or Sapphire Wafer ,which the Diameter of it can support φ100~φ210mm,The Width Range
will be about 10~500mm.Cylindrical precision can be 0.01mm.
